Huawei unveils tau scaling law and LogicFolding architecture to counter US sanctions (xataka.com)

• Huawei unveils tau scaling law at ISCAS 2026
• LogicFolding architecture reduces signal delays
• First Kirin chip with new architecture planned for autumn 2026

"At IEEE ISCAS 2026 in Shanghai, Huawei's He Tingbo announced the 'tau scaling law' which focuses on reducing signal transit time (τ) rather than shrinking transistors. The LogicFolding architecture will debut in Kirin chips this autumn. Huawei aims to reach an equivalent 1.4nm process by 2031 despite US restrictions on advanced lithography equipment."