Imec updates chip roadmap to 2041, targeting 0.2 nm with CFETs (heise.de)

• Transition from GAA-FETs to CFETs expected in 2033.
• Four full-node generations: A10, A7, A5, A3 by 2041.
• A3 node features sequential CFET, CPP 39 nm, cell height 50 nm.
• 2D materials (graphene) considered for post-2041 nodes.

"Belgium's Imec has published a roadmap for chip manufacturing through 2041. The roadmap shifts from GAA-FETs to CFETs in 2033, with four full-node generations: A10, A7, A5, and A3. The A3 process (approximately 0.2 nm) uses sequential wafer stacking. Beyond 2041, 2D materials like graphene are considered."