TSMC Strategic Roadmap through 2029 (heise.de)

• Rollout of A13, A12, and N2U processes by 2029.
• Strategic shift in handling increasing chip architectural complexity.
• Commitment to sustaining leadership in sub-nanometer manufacturing.

"TSMC has unveiled its updated semiconductor manufacturing roadmap leading into 2029. Key additions include the A13, A12, and N2U manufacturing processes designed to maintain competitive dominance. The company is also restructuring its approach to chip design to address the growing architectural complexity of modern high-performance hardware."