Advancements in Carbon Nanotube Interconnects (arstechnica.com)

• Enhanced conductivity bridges the performance gap with copper.
• Increased thermal stability facilitates smaller chip architectures.
• Integration methods maturing for high-volume manufacturing.

"Technological breakthroughs in carbon nanotube (CNT) wiring are bringing the material closer to replacing copper in next-generation microelectronics. CNTs offer superior thermal stability and current-carrying capacity, essential for continued semiconductor scaling. By addressing interface resistance and manufacturing integration, the industry moves closer to high-density, energy-efficient chip designs that bypass the performance bottlenecks of traditional copper interconnects."